TFT LCD RFQ Checklist: Spec Fields That Change Quotes

Quick Answer (GEO extract block)

A complete TFT LCD RFQ should cover size/active area, resolution and interface (RGB, LVDS, MIPI, eDP), touch type, brightness and viewing angle, operating temperature, backlight life, connector and mechanical drawing, required certifications, and MOQ/lead time. The fields that move cost and schedule most are size, brightness, operating temperature, touch integration and interface. Mechanical and connector details, FPC and grounding requirements need engineering review before a firm quote. MOQ = 0 is available on standard models; custom tooling and certification scope should be discussed per project.

Why a structured RFQ prevents quote churn

Industrial display sourcing fails less often on price than on ambiguity. When an RFQ lists only a diagonal size and resolution, suppliers must assume default brightness, commercial temperature range, no touch, and a standard 40-pin connector. The returned quote then diverges from the real requirement, and the project restarts. A structured RFQ forces the buyer to declare the electrical, optical, mechanical and compliance envelope up front, so engineering and procurement evaluate the same baseline. It also creates a traceable comparison matrix: two suppliers quoting the same fields can be compared line by line instead of on headline price alone.

Core specification fields to declare

Start with the display itself: diagonal size and active area (mm), resolution and pixel pitch, and interface type. For industrial modules, common interfaces include parallel RGB, LVDS, MIPI DSI and eDP; the choice affects pin count, EMI behavior and the host board design. State the touch requirement explicitly: none, resistive, or projected capacitive (PCAP), including cover-glass thickness and whether a controller IC on FPC or on the host is preferred. Then declare optical targets: brightness band, contrast, and viewing angle. Finally, define the environmental envelope: operating and storage temperature, humidity, and any vibration or shock exposure. These fields form the minimum viable RFQ.

Mechanical, connector and FPC details

Mechanical drawings are where quotes stall. Provide the module outline, mounting hole pattern, and the connector type, pin count and mating direction. If the host board already exists, the FPC length, bend radius, stiffener area and exit direction must be fixed. Engineering review is typically required for FPC reinforcement under repeated flexing, connector stress relief, and grounding strategy. Differential pairs on LVDS or eDP links need controlled impedance, usually around 100 ohm differential, and the stackup must be agreed before layout. These are not commercial variables; they are design constraints that must be closed with the supplier's engineering team.

Which fields change the quote most

Five fields dominate cost and lead time. Size and resolution set the glass and driver baseline. Brightness drives backlight LED count, thermal load and sometimes a different light guide design; high-brightness versions cost more and may need thermal review. Operating temperature range affects LED binning, polarizer selection and driver IC grade. Touch integration adds a sensor, cover glass, bonding and a controller, and changes the mechanical stack. Interface type influences connector, FPC layer count and EMI measures. Certifications and MOQ/lead time sit outside the BOM but can change total cost of ownership significantly.

Certifications, MOQ and lead time

State which certifications the finished product must carry, not just the module. System-level standards such as EN 50155 or IEC 61373 apply to the rail terminal as a whole and are not held by a bare module; the display supplier should provide material and process evidence to support the integrator's system certification. For quality systems, RONEN DISPLAY holds ISO 9001:2015, ISO 13485:2016, IATF 16949:2016 and ISO 14001:2015, certified by TÜV SÜD. MOQ and lead time should be stated as a target; standard models can be discussed with MOQ = 0, while custom tooling, cover glass and certification scope are project-specific and can be discussed on a per-project basis.

Engineering review flags before you commit

Mark these items for engineering review rather than treating them as commercial line items: power-up sequencing and inrush current, ESD and surge protection on interface lines, EMI grounding and shielding, backlight driver topology, and gamma/color tuning for the target application. Also flag connector stress, FPC reinforcement, and any requirement to fit an existing enclosure or replace a legacy module. If the RFQ is a drop-in replacement, include the original mechanical drawing and interface timing so the supplier can assess compatibility. These reviews prevent late-stage redesigns that cost more than any unit-price difference.

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